HyPox DA323
HyPox DA323
HyPox DA323 is an adduct of a DGEBA resin and a dimer fatty acid. At room temperature, the product is a semisolid that requires mild heating to assist flow or pumping. The introduction of the fatty acid to the DGEBA backbone yields a resin that will impart a degree of flexibility to cured epoxy formulations.
HyPox® DA323 adduct is usually blended with other epoxy resins and/or diluents to improve thermal shock and impact resistance. Improvements in adhesion and peel strength will also be realized. These improvements occur with some sacrifice in heat resistance as exemplified by a lowering of Tg with increasing HyPox DA323 adduct concentration. The product is compatible with all standard epoxy resins and curing agents.
Applications for HyPox DA323
- Adhesives
- Encapsulants
- Potting
- Coatings
- Toughening of prepreg and composites
Properties
| Typical Properties | Value |
| Appearance | Clear, clean |
| Epoxide Equivalent Weight, g/eq | 600 – 725 |
| Gardner Color, max | 12 |
| Weight per Gallon at 25°C, lb | 9.0 |
| Flash Point, COC, °C (°F) | > 200 (392) |
| Viscosity at 52°C, cP | 50,000 |
| Dimer Acid Content, % | 45 |
Check out other HyPox Elastomer Modified Epoxy Resins in the CVC Product Brochure!
