OMICURE DDA 10
OMICURE DDA 10
OMICURE DDA 10 is a micronized grade of dicyandiamide, a solid latent curing agent for epoxy resins. It has a mean particle size of approximately 12 μ and is one of several grades of dicyandiamide offered by CVC Thermoset Specialties that differ in particle size. OMICURE® DDA 10 contains approximately 2% silica as an anticaking aid.
Like other grades of dicy, this product is dispersed into a resin system where it remains stable until activated by heat. Without an accelerator, such as substituted urea, dicyandiamide has an activation temperature of about 350 °F and a formulated storage stability of over six months. When catalyzed with a latent accelerator, like one of the OMICURE U series of substituted ureas, one-component adhesive and sealant formulas can be prepared with cure temperatures of 225-250°F and excellent stability. The fine particle size of OMICURE DDA 10 will help aid good dispersion, prevent settling, and promote uniform cure to formulated systems without the worry of ‘hot spots.’
Epoxy systems cured with OMICURE DDA 10 are characterized by outstanding adhesion, making it a preferred choice for adhesive formulations. This product is compatible with all epoxy resins, including bisphenol A and F epoxies and epoxy novolacs, can be used with diluted or undiluted resins, and is compatible with a wide variety of fillers and pigments. OMICURE DDA 10 is safe to handle and is considered nontoxic.
Applications for OMICURE DDA 10
- One-component adhesives
- Epoxy powder coatings
- Prepregs, composites, and film adhesives
- Electronic potting and encapsulating compounds
Properties
Check out other OMICURE Curing Agents, Accelerators, and Catalysts in the CVC Product Brochure!
