OMICURE DDA 5
OMICURE DDA 5
OMICURE DDA 5 is an ultra-micronized grade of dicyandiamide, a solid latent curing agent for epoxy resins. It has a mean particle size of approximately 4 microns and is one of several grades of Dicyandiamide offered by CVC Thermoset Specialties that differ in particle size. OMICURE® DDA 5 contains approximately 2% – 3% silica as an anticaking aid. This product typically cures epoxy more quickly than other grades of dicyandiamide.
Like other grades of dicy, this product is dispersed into a resin system where it remains stable until activated by heat. Without an accelerator, such as a substituted urea, dicyandiamide has an activation temperature of about 350°F and a formulated storage stability of over six months. When catalyzed with a latent accelerator, like one of the OMICURE U series of substituted ureas, one-component adhesive and sealant formulas can be prepared with cure temperatures of 225-250°F and excellent stability. The ultrafine particle size of OMICURE DDA 5 will help to aid good dispersion, prevent settling, maximize reactivity, promote uniform cure to formulated systems, and avoid issues of ‘hot spots.’
Epoxy systems cured with OMICURE DDA 5 are characterized by outstanding adhesion, making it a preferred choice for adhesive formulations. It is compatible with all epoxy resins, including bisphenol A and F epoxies and epoxy novolacs, can be used with diluted or undiluted resins, and is compatible with a wide variety of fillers and pigments. This product is safe to handle and is considered nontoxic.
Applications for OMICURE DDA 5
- One-component adhesives
- Advanced composites and prepregs
- Epoxy powder coatings
- Industrial coatings
- Film adhesives
- Electronic potting and encapsulating compounds
Properties
Check out other OMICURE Curing Agents, Accelerators, and Catalysts in the CVC Product Brochure!
