OMICURE DDA 50
OMICURE DDA 50
OMICURE DDA 50 is a semi-micronized grade of dicyandiamide, a solid latent curing agent for epoxy resins. It has a mean particle size of approximately 20 μ and is one of several grades of dicyandiamide offered by CVC Thermoset Specialties that differ in particle size. OMICURE® DDA 50 contains approximately 2% silica as an anticaking aid.
Like other grades of dicy, this product is dispersed into a resin system where it remains stable until activated by heat. Without an accelerator, such as a substituted urea, dicyandiamide has an activation temperature of about 350°F and a formulated storage stability of over six months. When catalyzed with a latent accelerator, like one of the OMICURE U series of substituted ureas, one-component adhesive and sealant formulas can be prepared with cure temperatures of 225-250°F and provide excellent stability. This product will help provide cost-effective, stable, elevated-temperature-cured adhesives, composites, coatings, and other formulated systems.
Epoxy systems cured with OMICURE DDA 50 are characterized by outstanding adhesion, making it a preferred choice for cost-effective adhesive formulations. It
is compatible with all epoxy resins, including bisphenol A and F epoxies and epoxy novolacs, can be used with diluted or undiluted resins, and is compatible with a wide variety of fillers and pigments. It is safe to handle and is considered nontoxic.
Applications for OMICURE DDA 50
- One-component adhesives
- Epoxy powder coatings
- Prepregs and film adhesives
- Electronic potting and encapsulating compounds
Properties
Check out other OMICURE Curing Agents, Accelerators, and Catalysts in the CVC Product Brochure!
