Dicyandiamide Based Epoxy Curing Agents
Application: Aerospace, Construction Adhesive, Energy/Oilfield/Wind, Industrial Composite, LSDA-Sound Damping, Powder Coating, PVC, Sports & Rec
Product Category: Dicyandiamide Based Epoxy Curing Agents
Micronized grade of Dicyandiamide, a solid latent curing agent for epoxy resins. Fine particle size with good dispersibility, reactivity and uniform cure.
View ProductDownload TDSReady to BuyTalk to an ExpertRequest SampleApplication: Aerospace, Construction Adhesive, Energy/Oilfield/Wind, Industrial Composite, LSDA-Sound Damping, Powder Coating, PVC, Sports & Rec
Product Category: Dicyandiamide Based Epoxy Curing Agents, Epoxy Curing Agents
Coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. For applications where particle size is not an issue. Contains no flow control agent.
View ProductDownload TDSReady to BuyTalk to an ExpertRequest SampleApplication: Aerospace, Construction Adhesive, Energy/Oilfield/Wind, Industrial Composite, LSDA-Sound Damping, Powder Coating, PVC, Sports & Rec
Product Category: Dicyandiamide Based Epoxy Curing Agents, Epoxy Curing Agents
Ultra-Fine particle size Dicyandiamide, a solid latent curing agent for epoxy resins. For the most critical applications. Provides excellent dispersibility, maximum reactivity, uniform cure, and low settling potential.
View ProductDownload TDSReady to BuyTalk to an ExpertRequest SampleApplication: Aerospace, Construction Adhesive, Energy/Oilfield/Wind, Industrial Composite, LSDA-Sound Damping, Powder Coating, PVC, Sports & Rec
Product Category: Dicyandiamide Based Epoxy Curing Agents, Epoxy Curing Agents
Intermediate particle size Dicyandiamide, a solid latent curing agent for epoxy resins. Provides cost-effective, stable, one-part systems for elevated temperature cure application.
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