Solid, unmodified bisphenol A epoxy resin solutions. Excellent adhesion, flow and wetting. Good chemical resistance.

Very high molecular weight epoxy resin supplied at 32% non-volatiles in propylene glycol monomethyl ether acetate. It provides outstanding adhesion, flexibility and toughness and is designed for formulating heat-cured industrial coatings.

Low molecular weight solid epoxy resin solutions suitable for the formulation of a wide variety of solvent borne coatings formulations.

Blend of a modified liquid Bisphenol A diglycidyl ether resin in methylisobutyl ketone designed for fast cure, low viscosity and low temperature applications.

Blend of a modified liquid Bisphenol A diglycidyl ether resin in xylene designed for fast cure, low viscosity, and low temperature applications.

A solution of a high functionality, high viscosity epoxidized phenol novolac resin. It is supplied at 80% solids in methyl amyl ketone (MAK).

A solution of a high functionality, high viscosity epoxidized phenol novolac resin. It is supplied at 85% solids in methyl ethyl ketone(MEK).

A solution of a high functionality (3.6), high viscosity, epoxidized phenol novolac resin. It is supplied at 80 percent solids in xylene.

A 3.9 functional epoxy phenol novolac resin supplied @ 85% solids in acetone. It combines low hydrolyzable chloride content with good reactivity.