OMICURE 24EMI
OMICURE 24EMI
OMICURE 24EMI is a liquid high-temperature performance 2-Ethyl-4-Methyl Imidazole for use in filament winding, electrical laminates, coatings, and laminating adhesives. Unlike other grades of EMI, OMICURE® 24EMI is non- crystallizing and significantly lower in irritation allowing for easier, safer handling. Because no heat is required for mixing, longer pot lives are achieved. This product is typically used at 1 – 3% as an accelerator for anhydrides or from 2 – 5% as the sole hardener for catalytic cures. This yields cured resins with better oxidation, aging, and improved high-temperature performance versus MDA.
Applications for OMICURE 24EMI
- Filament winding/impregnation systems
- Long pot life of impregnation resin systems, low cure temperature for maximum properties, and high HDT achievable
- Adhesives
- Ideally suited for short baked cures at lower temperature. Excellent adhesion to metal and glass. Good dimensional stability of cured system, even at higher service temperatures
- Electrical/electronics
- Effective with anhydrides to accelerate B-stage cure times. Excellent retention of electrical properties
- Coatings
- Longer shelf stability for solvent-based coatings. Excellent for high chemical and heat resistance in baked systems, including pipe and foundry coatings. Effective in high temperature service environments versus MDA.
Features & Benefits
- Non-crystallizing low viscosity liquid
- Easier handling, lower product losses. No heat is required to achieve uniform mixing with excellent pot life vs. solid systems. Well suited to casting and impregnation systems for maximum fiber contact
- Low toxicity/less irritating
- Significantly lower toxicity than most aromatic amines and lower dermatitis potential than other imidazoles results in safer operations
- High EDT with low volatility
- Excellent HDT with low weight loss and shrinkage vs. other curing systems. Results are reduced stress and higher tensile strength. Can yield HDTs higher than cure temperature
- Lower cure temperature required
- Achieves maximum mechanical properties at lower temperatures. Especially useful in induction curing and filament winding
Properties
Check out other OMICURE Curing Agents, Accelerators, and Catalysts in the CVC Product Brochure!
