Curing Agents & Crosslinkers
Application: Electrical (Encapsulation)
Product Category: Epoxy Curing Agents, Imidazole
Accelerator for anhydrides and catalyst for high temperature epoxies. Faster reactivity vs. BDMA or tertiary amine substituted phenols.
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Product Category: Epoxy Curing Agents
Aromatic Amine/Curing Agent. A safer replacement for MDA. Can yield higher compressive strength, higher HDT (heat distortion temperature) and less brittleness than MDA (Methylene Dianiline).
View ProductDownload TDSReady to BuyTalk to an ExpertRequest SampleApplication: Electrical (Encapsulation), Energy/Oilfield/Wind, Industrial Composite
Product Category: Epoxy Curing Agents
Can be used as sole curing agent or as accelerator for Anhydrides, Dicyandiamide or Aromatic Amines. Clear, compatible formulations. Very long room temperature shelf life.
View ProductDownload TDSReady to BuyTalk to an ExpertRequest SampleApplication: Aerospace, Construction Adhesive, Energy/Oilfield/Wind, Industrial Composite, LSDA-Sound Damping, Powder Coating, PVC, Sports & Rec
Product Category: Dicyandiamide Based Epoxy Curing Agents
Micronized grade of Dicyandiamide, a solid latent curing agent for epoxy resins. Fine particle size with good dispersibility, reactivity and uniform cure.
View ProductDownload TDSReady to BuyTalk to an ExpertRequest SampleApplication: Aerospace, Construction Adhesive, Energy/Oilfield/Wind, Industrial Composite, LSDA-Sound Damping, Powder Coating, PVC, Sports & Rec
Product Category: Dicyandiamide Based Epoxy Curing Agents, Epoxy Curing Agents
Coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. For applications where particle size is not an issue. Contains no flow control agent.
View ProductDownload TDSReady to BuyTalk to an ExpertRequest SampleApplication: Aerospace, Construction Adhesive, Energy/Oilfield/Wind, Industrial Composite, LSDA-Sound Damping, Powder Coating, PVC, Sports & Rec
Product Category: Dicyandiamide Based Epoxy Curing Agents, Epoxy Curing Agents
Ultra-Fine particle size Dicyandiamide, a solid latent curing agent for epoxy resins. For the most critical applications. Provides excellent dispersibility, maximum reactivity, uniform cure, and low settling potential.
View ProductDownload TDSReady to BuyTalk to an ExpertRequest SampleApplication: Aerospace, Construction Adhesive, Energy/Oilfield/Wind, Industrial Composite, LSDA-Sound Damping, Powder Coating, PVC, Sports & Rec
Product Category: Dicyandiamide Based Epoxy Curing Agents, Epoxy Curing Agents
Intermediate particle size Dicyandiamide, a solid latent curing agent for epoxy resins. Provides cost-effective, stable, one-part systems for elevated temperature cure application.
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Product Category: Accelerators
2,4 Toluene bis Dimethyl Urea. Catalyst for Accelerating the Cure Speed and Lowering the Cure Temperature of Epoxy Systems
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Product Category: Accelerators
Cycloaliphatic bisurea. Catalyst for Accelerating the Cure Speed and Lowering the Cure Temperature of Epoxy Systems
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Product Category: Accelerators
Phenyl Dimethyl Urea. Catalyst for Accelerating the Cure Speed and Lowering the Cure Temperature of Epoxy Systems
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Product Category: Accelerators
80/20 Toluene bis Dimethyl Urea - Technical Grade. Catalyst for Accelerating the Cure Speed and Lowering the Cure Temperature of Epoxy Systems
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Product Category: Accelerators
4,4' Methylene bis (phenyl dimethyl urea) - Technical Grade. Catalyst for Accelerating the Cure Speed and Lowering the Cure Temperature of Epoxy Systems
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