Micronized grade of Dicyandiamide, a solid latent curing agent for epoxy resins. Fine particle size with good dispersibility, reactivity and uniform cure.

Coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. For applications where particle size is not an issue. Contains no flow control agent.

Ultra-Fine particle size Dicyandiamide, a solid latent curing agent for epoxy resins. For the most critical applications. Provides excellent dispersibility, maximum reactivity, uniform cure, and low settling potential.

Intermediate particle size Dicyandiamide, a solid latent curing agent for epoxy resins. Provides cost-effective, stable, one-part systems for elevated temperature cure application.